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19-2739; Rev 2; 11/04
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
General Description
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are low-capacitance 15kV ESD-protection diode arrays designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND. The MAX3202E/MAX3203E/MAX3204E/MAX3206E protect against ESD pulses up to 15kV Human Body Model, 8kV Contact Discharge, and 15kV Air-Gap Discharge, as specified in IEC 61000-4-2. These devices have a 5pF capacitance per channel, making them ideal for use on high-speed data I/O interfaces. The MAX3202E is a two-channel device intended for USB and USB 2.0 applications. The MAX3203E is a triple-ESD structure intended for USB On-the-Go (OTG) and video applications. The MAX3204E is a quad-ESD structure designed for Ethernet and FireWireTM applications, and the MAX3206E is a six-channel device designed for cell phone connectors and SVGA video connections. All devices are available in tiny chip-scale (UCSPTM) and thin QFN packages, and are specified for -40C to +85C operation.
Features
High-Speed Data Line ESD Protection 15kV--Human Body Model 8kV--IEC 61000-4-2, Contact Discharge 15kV--IEC 61000-4-2, Air-Gap Discharge Tiny UCSP Package Available Low 5pF Input Capacitance Low 1nA (max) Leakage Current Low 1nA Supply Current +0.9V to +5.5V Supply Voltage Range 2-, 3-, 4-, or 6-Channel Devices Available
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Ordering Information
PART MAX3202EEBS-T MAX3202EETT-T MAX3203EEBT-T MAX3203EETT-T MAX3204EEBT-T MAX3204EETT-T MAX3206EEBL-T MAX3206EETC TEMP RANGE -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C PIN/BUMPPACKAGE 2 x 2 UCSP-4* 6 Thin QFN-EP-6** 3 x 2 UCSP-5* 6 Thin QFN-EP-6** 3 x 2 UCSP-6* 6 Thin QFN-EP-6** 3 x 3 UCSP-8* 12 Thin QFN-EP**
Applications
USB USB 2.0 Ethernet FireWire Video Cell Phones SVGA Video Connections
Selector Guide
PART MAX3202EEBS-T MAX3202EETT MAX3203EEBT-T MAX3203EETT MAX3204EEBT-T MAX3204EETT MAX3206EEBL-T MAX3206EETC ESDPROTECTED I/O PORTS 2 2 3 3 4 4 6 6 TOP MARK AFV ADQ ABA ADO ABB ADP ADU AACA
*UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section for more information. **EP = Exposed pad.
Typical Operating Circuit
VCC VCC
0.1F 0.1F PROTECTED CIRCUIT I/0 I/0_
Pin Configurations appear at end of data sheet. FireWire is a trademark of Apple Computer, Inc. UCSP is a trademark of Maxim Integrated Products, Inc.
MAX3202E MAX3203E MAX3204E MAX3206E
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +7.0V I/O_ to GND ................................................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70C) 2 x 2 UCSP (derate 3.0mW/C above +70C) ..............239mW 3 x 2 UCSP (derate 3.4mW/C above +70C) ..............273mW 3 x 2 UCSP (derate 3.9mW/C above +70C) ..............308mW 3 x 3 UCSP (derate 4.7mW/C above +70C) ..............379mW 6-Pin Thin QFN (derate 24.4mW/C above +70C) ....1951mW 12-Pin Thin QFN (derate 16.9mW/C above +70C) ..1349mW Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Junction Temperature .....................................................+150C Bump Temperature (soldering) (Note 1) Infrared (15s) ................................................................+220C Vapor Phase (60s) ........................................................+215C Lead Temperature (soldering, 10s) .................................+300C
Note 1: The UCSP devices are constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection Reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +5V 5%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25C.) (Note 2)
PARAMETER Supply Voltage Supply Current Diode Forward Voltage SYMBOL VCC ICC VF IF = 10mA TA = +25C, 15kV Human Body Model, IF = 10A Channel Clamp Voltage (Note 3) VC TA = +25C, 8kV Contact Discharge (IEC 61000-4-2), IF = 24A TA = +25C, 15kV Air-Gap Discharge (IEC 61000-4-2), IF = 45A Channel Leakage Current Channel Input Capacitance ESD PROTECTION Human Body Model IEC 61000-4-2 Contact Discharge IEC 61000-4-2 Air-Gap Discharge 15 8 15 kV kV kV TA = 0C to +50C (Note 4) VCC = 5V, bias of VCC/2 Positive transients Negative transients Positive transients Negative transients Positive transients Negative transients -1 5 0.65 CONDITIONS MIN 0.9 1 TYP MAX 5.5 100 0.95 VCC + 25 -25 VCC + 60 V -60 VCC + 100 -100 +1 7 nA pF UNITS V nA V
Note 2: Limits over temperature are guaranteed by design, not production tested. Note 3: Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the Applications Information section for more information. Note 4: Guaranteed by design. Not production tested.
2
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Typical Operating Characteristics
(VCC = +5V, TA = +25C, unless otherwise noted.)
CLAMP VOLTAGE vs. DC CURRENT
MAX3202E toc01
LEAKAGE CURRENT vs. TEMPERATURE
MAX3202E toc02
INPUT CAPACITANCE vs. INPUT VOLTAGE
MAX3202E toc03
1.50 1.30 CLAMP VOLTAGE (V) 1.10 0.90 0.70 0.50 0.30 30 50 70 90 110 130
1000
LEAKAGE CURRENT PER CHANNEL
12
100
INPUT CAPACITANCE (pF)
10
LEAKAGE CURRENT (pA)
8
VCC = 3.3V
6 VCC = 5.0V 4
10
1 150 25 35 45 55 65 75 85 DC CURRENT (mA) TEMPERATURE (C)
2 0 1 2 3 4 5 INPUT VOLTAGE (V)
Pin Description
PIN MAX3202E UCSP THIN QFN 3, 6 4 1 2, 5 EP MAX3203E UCSP A1, A2, B3 B1 A3 -- -- THIN QFN 1, 2, 4 3 6 5 EP MAX3204E UCSP A1, A2, B2, B3 B1 A3 -- -- THIN QFN 1, 2, 4, 5 3 6 -- EP MAX3206E UCSP A1, A3, B1, B3, C1, C3 A2 C2 -- -- THIN QFN 1, 2, 3, 7, 8, 9 5 11 4, 6, 10, 12 EP I/O_ GND VCC N.C. EP ESD-Protected Channel Ground Power-Supply Input. Bypass VCC to GND with a 0.1F ceramic capacitor. No Connection. Not internally connected. Exposed Pad. Connect to GND. NAME FUNCTION
A1, B2 A2 B1 -- --
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Detailed Description
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are diode arrays designed to protect sensitive electronics against damage resulting from ESD conditions or transient voltages. The low input capacitance makes these devices ideal for high-speed data lines. The MAX3202E, MAX3203E, MAX3204E, and MAX3206E protect two, three, four, and six channels, respectively. The MAX3202E/MAX3203E/MAX3204E/MAX3206E are designed to work in conjunction with a device's intrinsic ESD protection. The MAX3202E/MAX3203E/MAX3204E/ MAX3206E limit the excursion of the ESD event to below 25V peak voltage when subjected to the Human Body Model waveform. When subjected to the IEC 61000-4-2 waveform, the peak voltage is limited to 60V when subjected to Contact Discharge and 100V when subjected to Air-Gap Discharge. The device that is being protected by the MAX3202E/MAX3203E/ MAX3204E/MAX3206E must be able to withstand these peak voltages plus any additional voltage generated by the parasitic board.
d(IESD ) d(IESD ) VC = VCC + VF(D1) + L1 x + L2 x dt dt
For negative ESD pulses: d(IESD ) d(IESD ) VC = - VF(D2) + L1 x + L3 x dt dt where IESD is the ESD current pulse.
POSITIVE SUPPLY RAIL
L2
D1 L1 I/O_ PROTECTED LINE D2
Applications Information
Design Considerations
Maximum protection against ESD damage results from proper board layout (see the Layout Recommendations section and Figure 2). A good layout reduces the parasitic series inductance on the ground line, supply line, and protected signal lines. The MAX3202E/MAX3203E/MAX3204E/MAX3206E ESD diodes clamp the voltage on the protected lines during an ESD event and shunt the current to GND or VCC. In an ideal circuit, the clamping voltage, VC, is defined as the forward voltage drop, VF, of the protection diode plus any supply voltage present on the cathode. For positive ESD pulses: VC = VCC + VF For negative ESD pulses: VC = -VF In reality, the effect of the parasitic series inductance on the lines must also be considered (Figure 1). For positive ESD pulses:
L3 GROUND RAIL
Figure 1. Parasitic Series Inductance
VCC L1 PROTECTED LINE NEGATIVE ESD CURRENT PULSE PATH TO GROUND
L2
D1 VC I/O_ D2 L3 PROTECTED CIRCUIT
GND
Figure 2. Layout Considerations 4 _______________________________________________________________________________________
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
During an ESD event, the current pulse rises from zero to peak value in nanoseconds (Figure 3). For example, in a 15kV IEC-61000 Air-Gap Discharge ESD event, the pulse current rises to approximately 45A in 1ns (di/dt = 45 x 109). An inductance of only 10nH adds an additional 450V to the clamp voltage. An inductance of 10nH represents approximately 0.5in of board trace. Regardless of the device's specified diode clamp voltage, a poor layout with parasitic inductance significantly increases the effective clamp voltage at the protected signal line. A low-ESR 0.1F capacitor must be used between VCC and GND. This bypass capacitor absorbs the charge transferred by an +8kV IEC-61000 Contact Discharge ESD event. Ideally, the supply rail (VCC) would absorb the charge caused by a positive ESD strike without changing its regulated value. In reality, all power supplies have an effective output impedance on their positive rails. If a power supply's effective output impedance is 1, then by using V = I x R, the clamping voltage of VC increases by the equation VC = IESD x ROUT. An +8kV IEC 61000-4-2 ESD event generates a current spike of 24A, so the clamping voltage increases by VC = 24A x 1, or V C = 24V. Again, a poor layout without proper bypassing increases the clamping voltage. A ceramic chip capacitor mounted as close to the MAX3202E/ MAX3203E/MAX3204E/MAX3206E VCC pin is the best choice for this application. A bypass capacitor should also be placed as close to the protected device as possible. * 15kV using the Human Body Model * 8kV using the Contact Discharge method specified in IEC 61000-4-2 * 15kV using the IEC 61000-4-2 Air-Gap Discharge method ESD Test Conditions ESD performance depends on a number of conditions. Contact Maxim for a reliability report that documents test setup, methodology, and results. Human Body Model Figure 4 shows the Human Body Model, and Figure 5 shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the device through a 1.5k resistor.
RC 1M CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE RD 1.5k DISCHARGE RESISTANCE DEVICE UNDER TEST
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Cs 100pF
STORAGE CAPACITOR
15kV ESD Protection
ESD protection can be tested in various ways; the MAX3202E/MAX3203E/MAX3204E/MAX3206E are characterized for protection to the following limits:
Figure 4. Human Body ESD Test Model
I 100% 90% IPEAK
IP 100% 90% AMPERES 36.8%
Ir
PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE)
10% tR = 0.7ns to 1ns 30ns 60ns t
10% 0 0 tRL TIME tDL CURRENT WAVEFORM
Figure 3. IEC 61000-4-2 ESD Generator Current Waveform
Figure 5. Human Body Model Current Waveform 5
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
RC 50 to 100 CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE RD 330 DISCHARGE RESISTANCE DEVICE UNDER TEST
Cs 150pF
STORAGE CAPACITOR
3) Ensure short ESD transient return paths to GND and VCC. 4) Minimize conductive power and ground loops. 5) Do not place critical signals near the edge of the PC board. 6) Bypass VCC to GND with a low-ESR ceramic capacitor as close to VCC as possible. 7) Bypass the supply of the protected device to GND with a low-ESR ceramic capacitor as close to the supply pin as possible.
UCSP Considerations
For general UCSP package information and PC layout considerations, refer to Maxim Application Note 263, Wafer-Level Chip-Scale Package.
Figure 6. IEC 61000-4-2 ESD Test Model
___________________UCSP Reliability
IEC 61000-4-2 The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. The MAX3202E/ MAX3203E/MAX3204E/MAX3206E help users design equipment that meets Level 4 of IEC 61000-4-2. The main difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (Figure 6) the ESD-withstand voltage measured to this standard is generally lower than that measured using the Human Body Model. Figure 3 shows the current waveform for the 8kV IEC 61000-4-2 Level 4 ESD Contact Discharge test. The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized. The UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user's assembly methods, circuit-board material, and usage environment. The user should closely review these areas when considering use of a UCSP. Performance through operating life test and moisture resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSPs are attached through direct solder contact to the user's PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder-joint contact integrity must be considered. Table 1 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through environmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim's website at www.maxim-ic.com.
Layout Recommendations
Proper circuit-board layout is critical to suppress ESDinduced line transients. The MAX3202E/MAX3203E/ MAX3204E/MAX3206E clamp to 100V; however, with improper layout, the voltage spike at the device is much higher. A lead inductance of 10nH with a 45A current spike at a dv/dt of 1ns results in an ADDITIONAL 450V spike on the protected line. It is essential that the layout of the PC board follows these guidelines: 1) Minimize trace length between the connector or input terminal, I/O_, and the protected signal line. 2) Use separate planes for power and ground to reduce parasitic inductance and to reduce the impedance to the power rails for shunted ESD current.
Chip Information
DIODE COUNT: MAX3202E: 4 MAX3203E: 6 MAX3204E: 8 MAX3206E: 12 PROCESS: BiCMOS
6
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
Table 1. Reliability Test Data
TEST Temperature Cycle Operating Life Moisture Resistance Low-Temperature Storage Low-Temperature Operational Solderability ESD High-Temperature Operating Life CONDITIONS -35C to +85C, -40C to +100C TA = +70C -20C to +60C, 90% RH -20C -10C 8hr steam age 2000V, Human Body Model TJ = +150C DURATION 150 cycles, 900 cycles 240hr 240hr 240hr 24hr -- -- 168hr FAILURES PER SAMPLE SIZE 0/10, 0/200 0/10 0/10 0/10 0/10 0/15 0/5 0/45
MAX3202E/MAX3203E/MAX3204E/MAX3206E
Functional Diagrams
MAX3202E
MAX3203E
MAX3204E
MAX3206E
VCC
VCC
VCC
VCC
I/O1
I/O2
I/O1
I/O2
I/O3
I/O1
I/O2
I/O3
I/O4
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
GND
GND
GND
GND
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7
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Pin Configurations
TOP VIEW
(BUMPS ON BOTTOM)
GND I/O3 I/O1 A1 A2 GND A1 I/O2 A2 VCC A3 I/O3 A1 I/O2 A2 VCC I/O3 A3 I/O2 B1 A1 A2 A3 I/O4
MAX3206E
B3
I/O5
MAX3202E
VCC B1 B2 I/O2 B1 GND
MAX3203E
B3 I/O1 B1 GND
MAX3204E
B2 I/O4 B3 I/O1 I/O1 C1 C2 VCC C3 I/O6
UCSP
UCSP
UCSP
UCSP
N.C. 12
VCC 11
N.C. 10
MAX3202E
MAX3203E
MAX3204E
I/01 1 2 3 9 8 7 I/06 I/05 I/04
VCC N.C. I/01
1 2 3
6 5 4
I/02 N.C. GND
I/01 I/02 GND
1 2 3
6 5 4
VCC N.C. I/03
I/01 I/02 GND
1 2 3
6 5 4
VCC I/04
I/02 I/03
MAX3206E
I/03 4 N.C. 5 GND 6 N.C.
THIN QFN
THIN QFN
THIN QFN
THIN QFN
8
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
4L, UCSP 2x2.EPS
MAX3202E/MAX3203E/MAX3204E/MAX3206E
PACKAGE OUTLINE, 2x2 UCSP 21-0117 G
1 1
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9
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
6L, UCSP.EPS
PACKAGE OUTLINE, 3x2 UCSP 21-0097 G
1 1
10
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
9LUCSP, 3x3.EPS
MAX3202E/MAX3203E/MAX3204E/MAX3206E
PACKAGE OUTLINE, 3x3 UCSP 21-0093 I
1 1
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11
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) 6, 8, &10L, DFN THIN.EPS
C L C L
D N
PIN 1 INDEX AREA
E DETAIL A
E2
A
L e e
L
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
1
2
12
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Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
MAX3202E/MAX3203E/MAX3204E/MAX3206E
COMMON DIMENSIONS SYMBOL A D E A1 L k A2 MIN. 0.70 2.90 2.90 0.00 0.20 MAX. 0.80 3.10 3.10 0.05 0.40
0.25 MIN. 0.20 REF.
PACKAGE VARIATIONS PKG. CODE T633-1 T633-2 T833-1 T833-2 T833-3 T1033-1 T1433-1 T1433-2 N 6 6 8 8 8 10 14 14 D2 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.500.10 1.700.10 1.700.10 E2 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 2.300.10 e 0.95 BSC 0.95 BSC 0.65 BSC 0.65 BSC 0.65 BSC 0.50 BSC 0.40 BSC 0.40 BSC JEDEC SPEC MO229 / WEEA MO229 / WEEA MO229 / WEEC MO229 / WEEC MO229 / WEEC MO229 / WEED-3 ------b 0.400.05 0.400.05 0.300.05 0.300.05 0.300.05 0.250.05 0.200.05 0.200.05 [(N/2)-1] x e 1.90 REF 1.90 REF 1.95 REF 1.95 REF 1.95 REF 2.00 REF 2.40 REF 2.40 REF
DOWNBONDS ALLOWED
NO NO NO NO YES NO YES NO
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
2
2
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13
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces MAX3202E/MAX3203E/MAX3204E/MAX3206E
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) 24L QFN THIN.EPS
PACKAGE OUTLINE 12, 16, 20, 24L THIN QFN, 4x4x0.8mm
21-0139
C
1
2
14
______________________________________________________________________________________
Low-Capacitance, 2/3/4/6-Channel, 15kV ESD Protection Arrays for High-Speed Data Interfaces
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
MAX3202E/MAX3203E/MAX3204E/MAX3206E
PACKAGE OUTLINE 12, 16, 20, 24L THIN QFN, 4x4x0.8mm
21-0139
C
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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